Article
Version 1
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Applying Stamping Without Die to Micro-hole Array Processing
Version 1
: Received: 18 April 2023 / Approved: 19 April 2023 / Online: 19 April 2023 (03:34:27 CEST)
How to cite: Hung, Y. C.; Hsu, C. Y. Applying Stamping Without Die to Micro-hole Array Processing. Preprints 2023, 2023040531. https://doi.org/10.20944/preprints202304.0531.v1 Hung, Y. C.; Hsu, C. Y. Applying Stamping Without Die to Micro-hole Array Processing. Preprints 2023, 2023040531. https://doi.org/10.20944/preprints202304.0531.v1
Abstract
Aluminum alloy (Al6061) sheet micro-hole processing is extensively used in smartphones, tablet PC, and smart wearable devices. The micro-hole processing is commonly performed using laser, micro drilling, microstamping, micro discharge, and chemical etching technologies. Micro-stamping technology is characterized by precision and rapid processing, but the precision positioning of the punch head and lower die is one of the major difficulties in micro-hole stamping, especially in manufacturing array micro-holes. This study used stamping without die technology. This technology uses an array punch head to punch the lower die holes on the base, then performs array micro-hole stamping. The experimental results show that a micro-hole array with 37 micro-holes were successfully manufactured and can be reproduced many times. Tapered array micro-holes with a high aspect ratio can be manufactured using this stamping without die technology; the micro-hole depth can be 260μm, the inlet diameter is 116μm, and the outlet diameter is 25μm. This study has successfully developed the feasibility of array micro-hole stamping technology.
Keywords
stamping without die; precision positioning; micro-hole array
Subject
Engineering, Industrial and Manufacturing Engineering
Copyright: This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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