The most modern technique utilized to create intricate and complexly manufactured parts for a variety of applications is called additive manufacturing (AM). Fused deposition modeling (FDM) has received the greatest attention in the development and manufacturing sectors. The main objective of this study was to investigate how printing factors affected the mechanical characteristics of printed samples. Samples were produced using an FDM 3D printer in compliance with ASTM D638 using a variety of input settings, including orientation, layer thickness, speed, and infill pattern. On the printed samples, tensile tests and morphological analysis using a scanning electron microscope (SEM) were done. The findings of this study demonstrate that factors including layer thickness, printing speed, and orientation significantly affect the tensile strength of ABS printed samples. Discovering the process settings that could lead to superior mechanical and physical characteristics would undoubtedly assist designers and manufacturers worldwide as the FDM 3D printer becomes more and more crucial in manufacturing engineering parts.

Molecular dynamics simulations were performed to examine the impact of temperature (ranging from 250K to 350K) on the structural behavior of cellulose chains when dissolved in an aqueous cuprammonium hydroxide Cuam solvent system. By monitoring the root mean square deviation (RMSD) and radius of gyration (Rg) values at each temperature, we found that the geometric deformation of the cellulose chains changed significantly at T=300K. In contrast, Rg and RMSD values remained stable at temperatures in the range of 250K, 270K and the range of 330K, 350K. Calculating the interaction energy between the solvent and cellulose chains revealed that temperature significantly influences the cellulose dissolution process in the Cuam solvent system and that T=300K is an efficient temperature for its dissolution. The number of intra- and interchain hydrogen bonds was also calculated as a function of temperature, and the analysis confirmed that there is no breakage of these bonds at temperatures below 300 K (i,e: 250K, 270K) and above 310 K (I,e, : 330K and 350K) either between two native chains or between a native chain and another derivative.