At room temperature, the indentation morphologies of crystalline copper with different grain size including nanocrystalline (NC), ultrafine-grained (UFG) and coarse-grained (CG) copper were studied by nanoindentation at the strain rate of 0.04/s without holding time at indentation depth of 2000 nm. As the grain size increasing, the height of the pile-up around the residual indentation increases and then has a slightly decrease in the CG Cu, While the area of the pile-up increases constantly. Our analysis has revealed that the dislocation motion and GB activities in the NC Cu, some cross- and multiple-slips dislocation insides the larger grain in the UFG Cu, and forest dislocations from the intragranular Frank-Read sources in the CG Cu, would directly induce these distinct pile-up effect.