Preprint
Article

Introducing High School Students to Engineering Fundamentals by Four Weeks Engineering Innovation Summer Program

Altmetrics

Downloads

564

Views

332

Comments

0

This version is not peer-reviewed

Submitted:

11 June 2019

Posted:

13 June 2019

You are already at the latest version

Alerts
Abstract
Preparing high school students for engineering disciplines is crucial for sustainable scientific and technological developments in the USA. This paper discusses a pre-college program, which not only exposes students to various engineering disciplines but also enables them to consider engineering as the profession. The four-week long “Engineering Innovation (EI)” course is offered every year to high school students by the center of outreach, Johns Hopkins University. EI program is designed to develop problem-solving skills through extensive hands-on engineering experiments. A team consisting of an instructor, generally a PhD in Engineering, and a teaching fellow, generally a high school science teacher, closely work with students to pedagogically inculcate basics of core engineering disciplines such as civil, mechanical, electrical, materials, and chemical engineering. EI values independent problem-solving skills and simultaneously promote the team spirit among students. A number of crucial engineering aspects such as professional ethics, communications, technical writing, and understanding of common engineering principles are inculcated among high school students via well-designed individual and group activities. This paper discusses the model of EI program and its impact on students learning and their preparation for the engineering career.
Keywords: 
Subject: Social Sciences  -   Education
Copyright: This open access article is published under a Creative Commons CC BY 4.0 license, which permit the free download, distribution, and reuse, provided that the author and preprint are cited in any reuse.
Prerpints.org logo

Preprints.org is a free preprint server supported by MDPI in Basel, Switzerland.

Subscribe

© 2024 MDPI (Basel, Switzerland) unless otherwise stated