The current world economy is affected by scarcity of basic human necessities like clothing, shelter, domestic fuel, and food due to feedstock reserves depletion. Experts have been operational on different choices for exploring alternate ways for achieving better key solutions for such basic needs. In order to reduce the world’s dependency on fossil fuel, the implementation of subsequent ways such as fuels from renewable resources, production of green materials and chemicals is now gaining strength [1-4].
With the advancement of science and technology, there is need for development of such electronic units which have portability, miniature size as well as have highly integrated functions [
5]. Consequently, the electronic industry demands new interconnect bonding materials which have the ability to offer good electrical conductivity, satisfied thermal stability, flexibility along with low cost and environment friendliness. Polymers produced from renewable resources are also of great interest due to their lower cost and high abundance [6-8]. Electrically conductive adhesives (ECAs) are the excellent options for electronic industry to be used as an interconnection material since it offers improved electrical performance, fine pitch interconnect, environmental friendliness, and low processing temperatures [
9]. Mainly the composition of ECAs is of two part one is polymeric and other is filler. Polymeric part may consist of polymeric resins such as polyurethane, polyimide, silicones, acrylates, epoxy, or phenolic resins etc. [
10]. While the conductivity will be provided using conductive fillers such as Ag, Ni, graphite, graphene, CNTs etc. [11-13]. Various conductive fillers have been studied including zinc complexes [
14,
15], metal oxide [
16] cadmium [
17], cobalt nanoparticles [
18], and so on. However, some issues like poor interconnection between polymer resin and conductive fillers and aggregation are to be addressed. Suherman et al., has reported 28 Scm
-1 Suherman based upon 80% graphite with epoxy [
19]. The research group of Duarte and Paulo [
12] have studied epoxy resin composites consist of single & multiwalled carbon nanotubes (SWCNT & MWCNT) calculated volume resistivity of about 1×10
1 and 1×10
6 Ω.cm for SWCNT & MWCNT. In another work Dhakate
et al. [
20] have deliberated graphite (natural and synthetic) as the conductive material with epoxy resin for bipolar plates with the highest conductivity of about 150 Scm
-1. Nayak along with co-mates [
21] have extensively reviewed adhesives resins with various conductive fillers and reported thermal conductivity of 0.45 W/m.K. and 10
1 Scm
-1 as electrical conductivity for epoxy/single wall nanotubes of carbon based ECAs. Tang et al. [
22] designed and synthesized Silicone resin with functional silane and applied this as silver conducting inks, where Ag-silicone resin with 53.93 wt.% Ag shows the lowest resistivity of 1.43×10
-6 Ωm which was then applied as the conductive silver ink.