3.1. The comparison of heat transfer performance according to Cu powder type
Figure 5 shows the thermal resistance results for samples 100U and 200D. The test angles of 0˚, 45˚, and 90˚ are included, as well as the working fluid filling ratio, which ranges from 20% to 50%. The sintering process used a mandrel of 2mm in diameter, resulting in the formation of a wick with a thickness of 534.7 ㎛. For heat inputs of 12W or less, the overall thermal resistance of the 200D sample was lower than that of the 100U sample.
Figure 5(a) shows the thermal resistance values of the 100U and 200D samples when the working fluid filling level is at 20%. When the test is conducted at angles of 45˚ and 90˚, the 100U sample exhibits dry-out at a heat input of 3.5W. However, the 200D sample has a higher Q
max value of 10W or more. At a 30% filling ratio of the working fluid, the thermal resistance of 200D is higher than that of 100U, as shown in
Figure 5(b). The specimens showed comparable drying out points at both 45˚and 90˚, with little differences. Nevertheless, the thermal resistance of the 200D specimen was determined to be lower than 100U.
Figure 5(c, d) shows that the heat pipe encountered operational challenges and showed a notable beginning thermal resistance when the filling ratios were set at 40% and 50%. Therefore, even after subjecting the heat block to a rise in temperature of 120°C, it was not possible to determine the dry-out point.
Based on the previous capillary force test results, it is evident that the capillary force (
) is influenced by a complex correlation with both the porosity and the effective radius of the wick's pores (
). The 100U sample had the largest
value of 241.31 ㎛ and the 200D sample had the lowest one of 155.73 ㎛. Furthermore, the porosity value of 100U was found to be 59.07%, which was higher than the porosity value of 200D, which was estimated to be 56.47% [
3]. Nevertheless, the 200D sample exhibited stronger capillary forces. This could be attributed to the smaller effective radius (
) value, which indicates that the capillary force is mainly affected by the
value. Moreover, empirical evidence suggests that the powder filling density of 200D is higher than that of 100U, primarily because it covers a wider range of particle sizes. Therefore, applying a 200D powder-based wick has significant advantages in creating small, efficient pore sizes. This corresponds to the observation that 200D has superior thermal conductivity compared to 100U
3.2. Comparison of heat transfer performance according to sintered wick thickness and test angle
The heat pipe wicks were fabricated by sintering copper powders, with the inclusion of ceramic inner mandrels sized 1.5, 2, and 2.5 mm in diameter.
Figure 6 exhibits a cross-sectional SEM images of a heat pipe with a wick that has been installed subsequent to the sintering process. The average thickness of the wick structure was measured to be 902 ㎛, 534.7 ㎛, and 179.1 ㎛ for mandrel diameters of 1.5, 2, and 2.5 mm, respectively.
Figure 7 shows the thermal resistance measured in the 100U sample, varying the mandrel diameters and tilt angles. The thermal resistance primarily depends on the surface area of the interface between the liquid and vapor phases, as indicated by theoretical analysis [
10]. The sample with the smallest wick thickness (t
w) of 179.1 ㎛ (mandrel diameter: 1.5 mm) showed the highest thermal resistance, indicating the lowest thermal transfer capability in comparison to all other tested samples. Furthermore, the initial thermal resistance of this sample exhibited a notable difference compared to the thermal resistance of the other samples. In addition, the temperature at the evaporator section increased quickly in response to the heat input, ultimately reaching a maximum of 70℃ at a heat input of 5W. The substantial rise in temperature caused difficulties for accurately determining the final Q
max value. The present problems come from the inadequate thickness of the sintered wick, hindering the effective transfer of the condensed working fluid from the condenser section to the evaporator section via capillary force. Therefore, the pipe with the thinnest wick exhibited a comparatively lower heat transfer efficiency than the pipe with a thicker wick.
The heat resistance remained consistently low for both the 902 ㎛ and 534.7 ㎛ wick thicknesses, regardless of the test angle. Furthermore, it can be observed that the heat pipe with a wick thickness of 534.7 ㎛ has a higher dry-out temperature compared to the heat pipe with a thickness of 902 ㎛ at all tilting angles. Therefore, it can be concluded that the heat pipe with a medium-sized wick thickness of 534.7 ㎛ has superior heat transfer capability. This phenomenon can be explained by the decrease in the width of the vapor passage as the wick thickness increases, along with the corresponding increase in the surface area that comes into contact with the working fluid.
As the thickness of the wick increases, the surface area of liquid that can be absorbed by the wick also increases. This leads to a reduction in the pressure drop because the fluid can flow more easily through the wick. However, Li, Y et. al. [
11] observed that the pressure loss increased in direct proportion to the increase in the thickness of the heat pipe wick. They explained that the movement of the working fluid towards the evaporation section is controlled by the capillary force, causing the wick to become wet in multiple directions. As a result, there is a decrease in the amount of working fluid that has to be transported to the evaporation section when the wick is excessively thick. Moreover, an excessive thickness of the wick leads to a decrease in the cross-sectional area available for the passage of vapor through the pipe. Consequently, the friction coefficient of vapor in the vapor flow passage rises, thus serving as a constraint on the maximum heat transfer capacity. Conversely, if the wick is not thick enough, the passage becomes too small for the condensed working fluid in the condense sector to be transported to the vapor sector by capillary force.
The experimental results in this study coincide with the theory mentioned above, indicating that the optimal thermal transfer performance was attained by employing a wick thickness of a medium-sized 534.7 ㎛, which was produced using a mandrel with a diameter of 2 mm.
When the angle is 0˚, it is observed that the thermal resistance of the wick with a thickness of 902 ㎛ is relatively lower than that of the wick with a thickness of 534.7 ㎛. This difference can be attributed to the preferential movement of the working fluid within the heat pipe towards one side, caused by the force of gravity. This bias results from the basic assumptions that the wick on one side initiates its operation at relatively lower temperatures. Reducing the thickness of the wick causes the absorbed working fluid to accumulate mostly on the lower side of the heat pipe. The formation of a bubble barrier occurs as a result of the large amount of the working fluid, even at lower temperatures, which hinders the vapor's movement. Consequently, it has been determined that the initial thermal resistance exhibited a significant value [
12].
Therefore, it is important to take into account two factors when determining the thickness of the wick. Firstly, the wick should be thick enough to enable the transfer of the condensed internal working fluid from the condenser section to the vapor section using capillary force. Furthermore, it is also necessary that the internal space of the pipe is sufficiently large to ensure a proper pathway for the flow of vapor.
3.3. Comparison of heat transfer performance according to the working fluid filling ratio
Figure 8 shows the heat transfer performance of the heat pipe in relation to the filling ratio (R
f) of the working fluid at various tilting angles. The heat pipes in the experimental setup used a wick with the same wick thickness of 534.7 ㎛ (mandrel diameter: 2 mm), which was made by employing 200D copper powder. Samples were prepared by injecting 0.2 g (R
f = 20%), 0.3 g (R
f = 30%), and 0.4 g (R
f = 40%) of the working fluid into the heat pipe, giving a total filling amount of 1g.
At a filling ratio (R
f) of 50%, the thermal resistance exhibited the highest value at all test angles. In addition, the thermal resistance showed a tendency to decrease as the heat input increased. The initial thermal resistance is very high due to the excessive amount of working fluid, which requires more heat input to produce the latent heat of evaporation. The maximum permissible temperature for general electronic products employing semiconductors is 125℃ [
13]. The dry-out temperature could not be determined, even when the heat block temperature was raised to 130℃ or higher. Thus, when the heat pipe's wick has a thickness of 534.7 ㎛, it is evident that the heat transfer capacity significantly decreases when it is filled to a rate of 50% due to excessive filling. On the other hand, at a filling ratio (R
f) of 20%, the thermal resistance values consistently show the lowest levels, indicating superior thermal transfer capability regardless of the tested angles. However, the dry-out point is relatively low, meaning that the pipe cannot effectively perform heat transfer at high temperatures. The samples with
Rf = 30% and 40% exhibit the same heat resistance values at angles of 45° and 90°, as shown in
Figure 8(b, c). Nevertheless, when subjected to a power exceeding 13W, the sample with the R
f of 40% exhibits a slightly higher thermal resistance compared to the sample with the R
f of 30%. Two key requirements for an efficient heat pipe are low thermal resistance and a moderately high dry-out point. According to these criteria, it can be concluded that this heat pipe exhibits optimum heat transfer properties when the filling ratio (R
f ) of the working fluid is 30%.
As the filling ratio (Rf) of the working fluid rises, there is a proportional increase in the amount of fluid that undergoes a phase transition into vapor, as well as an increase in the quantity of fluid that returns back to a liquid state in the condenser section. The higher initial thermal resistance observed in the condenser section may be attributed to the presence of residual working fluid, which acts as a liquid barrier. Furthermore, when there is an extensive amount of fluid, the heat input required to convert the working fluid into vapor also increases. In this case, the thermal resistance remains high at lower temperatures. As the temperature rises, the liquid block reduces gradually, resulting in an increase in heat transfer capacity. As it improves, the corresponding value of Qmax increases.
Figure 9 shows a schematic diagram illustrating the progressive change of a liquid-vapor state in a heat pipe. The heat pipe contains a wick with a thickness of 534.7 ㎛, which is made of 200D powder. This transition proceeds as the temperature rises. During the initial stage, when the evaporation sector is being heated, the heat pipe exhibits a significant level of thermal resistance until the vapor is generated. Subsequently, despite a rise in temperature and the resulting generation of vapor in the evaporation sector, the presence of bubble blocks hinders the movement of vapor [
14]. As the temperature rises, these bubble blocks disappear, thereby enabling a possibility for heat transfer.
Afterwards, at a higher temperature, there is an increase in the amount of vapor accumulated in the condensation sector, while the amount of working fluid that need to be transported back to the evaporation sector through capillary force gradually decreases. In the case of a sustained rise in temperature, the working fluid in the evaporation sector becomes exhausted and the generation of evaporation-latent heat becomes impossible, leading to a dry-out state.
With an increase in the amount of working fluid, it is expected that the dry-out temperature will eventually increase. On the contrary, in order to achieve a low thermal resistance, it is essential to minimize the occurrence of initial bubble blockage caused by an excessive amount of working fluid. Therefore, it is necessary to maintain the working fluid at an appropriate level. The study observed that the optimal heat transfer capability was achieved when the level of working fluid was between 30-40%, which corresponds to results from previous researches. [
15,
16,
17,
18].