A magneto-electro-elastic medium generally consists of a combination of piezoelectric and piezomagnetic components. These components can be reinforced with layers or fibers. Such structures have the ability to convert electrical energy, magnetism and elasticity into each other. This is a unique property that is not present in a simple piezoelectric material. In special cases, the magnetic-electrical effect of MEE is far greater than that of single-phase magnetic-electric material, even with a significant magneto-electro coefficient [
1]. Because of these unique properties, MEEmaterials have a wide range of applications in intelligent structures such as magnetic field probes, medical imaging systems, transducers, sensors and actuators. [
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3,
4,
5]. Recently, many studies have been conducted by researchers to investigate the cracks in MEE structures. However, most of these studies have been mainly concerned with static loading [
6,
7,
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12,
13]. MEE materials experience dynamic loads in their functional cycle. Therefore, the analysis of the failure mechanism due to crack growth in such structures is one of the important design considerations and many researchers have focused on this issue. In the following, the studies conducted in this regard will be reviewed. Li presented the dynamic analysis of a crack in an MEE medium subjected to mechanical, electrical and magnetic impulse [
14]. Hu and Li presented an analytical approach to study the effect of a moving crack with permeable crack-face in an infinite MEE solid excited by shear loading [
15]. Zhou et al. [
16] addressed the dynamic behavior of collinear cracks between two dissimilar MEE material half planes under the harmonic anti-plane shear waves loading. Zhang et al. [
17] studied the dynamic behavior of two collinear interface cracks between two dissimilar functionally graded MEE material layers. Su et al. [
18] investigated the transient analysis of interface cracks between different MEE strips in the case of out-of-plane mechanical loading as well as magnetoelectrical impacts. Feng and Pan studied the dynamic fracture of anti-plane interfacial cracks under the influence of simultaneous mechanical and magnetoelectrical loadings in different boundary conditions [
19]. Liang examined the dynamic behavior of parallel symmetric cracks in a functionally graded MEE material excited by harmonic shear waves [
20]. Sladek et al. utilized Galerkin’ method to study cracks under transient loading in 2D and 3D axisymmetric piezoelectric/piezomagnetic medium [
21]. Feng et al. [
22] studied the dynamic response of surface cracks between two different MEE materials under simultaneous excitation of magnetic, electrical and mechanical shock. Zhong and Zhang [
23] and Zhong et al. [
24] investigated the dynamic analysis of an MEE material with a penny-shaped crack subjected to magneto-electro-mechanical impact loading. For the problems of a cracked MEE body under in-plane impacts, Feng et al. [
25] studied the dynamic behavior of an MEE penny-shaped cracked layer. Zhong et al. [
26] investigated the response of a MEE solid assumed to have a Griffith crack. Wang et al. [
27] examined the effect of electric and magnetic boundary conditions of crack-face on the dynamic response of an MEE structure. Li and Lee [
28] attempted to address the issue of collinear dissimilar cracks in MEE materials in mode I loadings through simulating dislocations. Wunsche et al. [
29] performed boundary element analysis to obtain dynamic response of linear an-isotropic MEE materials. Athanasius and Ang presented a semi-analytic approach using Laplace transform to obtain the dynamic response of a full space MEE with arbitrary number of arbitrarily oriented planar cracks [
30]. Li et al. [
31] studied the dynamic response of a ring-shaped interface crack between distinct magnetoelectroelastic materials. A ring-shaped crack between magnetoelectroelastic thin film and elastic substrate layers under mechanical, electrical and magnetic stress was reported by Li et al. [
32]. Lei et al. [
33] analyzed the transient response of an interface crack in MEE bi-materials subjected to magneto-electromechanical loads. The mode III fracture problem of a weakened MEE medium by an alternating array of cracks and rigid inclusions subjected to coupling of anti-plane mechanical and in-plane electrical and magnetic stress was studied by Xiao et al. [
34]. As far as the authors’ knowledge, there is no promising research on the transient response of multiple axisymmetric planar cracks in the transversely isotropic MEE material under in-plane magneto-electromechanical load. Among the techniques for solving such problems, the dislocation method [
35] is a useful tool for the analysis of multiple cracks. Therefore, this paper aims to specify the generalized dynamic intensity factors for multiple axisymmetric planar cracks in a transversely isotropic MEE medium. Laplace and Hankel transformations are utilized to simplify the problems to Cauchy-type singular integral equations. Then, a numerical Laplace transformation inversion method, presented by Stehfest [
36], utilized to formulate the generalized dynamic intensity factors of crack tips. The dislocation densities are determined to construct the multiple axisymmetric planar cracks in the transversely isotropic MEE medium. The influences of the time variation, the applied magnetoelectric impact loadings, boundary conditions of the crack surface and crack type as well as interactions between cracks on the dynamic characteristics of the crack are presented.