1. Introduction
The rise in demand for compact electronic devices and high-power LED lighting systems has underscored the critical importance of efficient thermal management alongside advances in battery and device technology [
1,
2,
3,
4]. As a critical aspect of thermal management, the effective dissipation of heat generated by the devices to the surrounding environment has received considerable attention. These include the use of various techniques, methods, and materials aimed at minimizing thermal resistance and utilizing materials with high thermal conductivity [
4,
5,
6,
7]. Among these, thermal interface materials (TIMs) are increasingly emerging as critical components that bridge the gap between heat sources (e.g., devices) and heat sinks (typically metal surfaces) [
3,
4,
8]. Previous research has explored various avenues, including the integration of high thermal conductivity metals and alloys [
5,
9], carbon-based materials such as graphene, graphene oxide (GO), and carbon nanotubes (CNTs) [
10,
11,
12,
13], and ceramic fillers such as aluminum nitride (AlN), boron nitride (BN), silicon carbide (SiC), aluminum oxide (Al
2O
3), and zinc oxide (ZnO) [
14,
15,
16,
17,
18,
19,
20,
21] into silicone rubber or epoxy resin matrices. In addition, efforts have extended to the development of composite materials with malleable thermally conductive fillers capable of conforming to intricate device and heat sink geometries, thereby improving processability and heat dissipation efficiency [
22,
23].
AlN exhibits remarkable properties including corrosion resistance, wear resistance, and exceptional thermal stability. Compared to materials such as Al2O3 (25–40 W/(m K)) [
24] and silicon nitride (Si
3N
4, 180 W/(m K)) [
25], AlN has a significantly higher isotropic thermal conductivity range (170-230 W/(m K), with a theoretical upper limit of 320 W/(m K)) [
26]. This level is comparable with the isotopically high thermal conductivity of h-BN (in-plane: 200–280 W/(m K)) [
27], a material characterized by its anisotropic thermal behavior. In addition, AlN has a remarkable electrical resistivity (> 1014 Ω cm), a coefficient of thermal expansion similar to that of silicon semiconductors (4.3 × 10
-6 K
-1 at room temperature) and is resistant to the halogen gas plasma often used in semiconductor manufacturing processes [
28]. These properties make AlN a promising ceramic filler candidate for improving the thermal conductivity of resins and rubbers [
14,
29,
30].
Despite the remarkable properties of AlN, its susceptibility to water-induced instability is a serious problem. When exposed to moisture, AlN oxidizes, denitrates, and hydrolyzes to form aluminum hydroxide and corrosive ammonia. The result is a decrease in thermal conductivity as the formation of non-thermal species takes precedence. Improving water resistance becomes an indispensable pursuit as we move toward the practical use of high thermal conductivity ceramic fillers such as AlN [
31,
32,
33,
34,
35,
36]. Generally, in order to effectively manage heat in semiconductors and similar devices, it is imperative to incorporate thermally conductive ceramic fillers at concentrations exceeding 60 % by volume, thereby attaining the necessary thermal conductivity (
Figure 1a). While increasing filler content increases thermal conductivity, it also affects the mechanical properties of TIM composites. Critical properties, such as tensile strength and elongation, are susceptible to decrease [
37,
38]. In addition, increasing filler content affects the inherent flexibility of matrix resins or rubbers and subsequently compromises thermal dissipation efficiency by degrading adhesion to the contact surfaces of devices and heat sinks. Therefore, a critical challenge in the quest for superior thermal transfer properties remains - strengthening the stability of AlN coupled with strategies to reduce the filler content in the rubber or resin matrix while maintaining high thermal conductivity.
Numerous efforts have focused on reducing the need for high AlN filler concentrations, including strategies such as particle coarsening and amalgamation with other fillers. On the other hands, the methods often result in the field of improving AlN stability, particularly in terms of thwarting hydrolysis, has spawned diverse approaches. These include chemical treatments, such as surface conditioning and surfactants, that modify the surface chemistry [
33]. In addition, shielding layers of materials such as GO, yttrium oxide (Y
2O
3), and silicon oxycarbonitride ceramics have been used to encapsulate AlN surfaces and insulate them from hydrolysis [
34,
35,
36]. However, there is a potential problem: the inadvertent deposition of materials with inferior thermal conductivity compared to AlN could obstruct thermal conduction pathways, resulting in a decrease in overall thermal conductivity. In addition, the presence of organic substances, including surfactants, can induce coalescence in processes such as AlN powder molding and sintering [
32]. It may also affect stability and mechanical properties of rubber or resin compounds that interact with matrix components. Furthermore, coatings containing conductive substances, such as GO, could potentially affect the insulating properties of AlN [
32]. While reports utilizing these strategies increase water resistance, they do not report on the critical issue of reducing the filler content within the composite matrix.
CNTs, analogous to GO in their function of enhancing AlN stability (water resistance), have recently received considerable attention as potential fillers for high thermal conductivity composites, particularly TIMs. CNTs have a one-dimensional (1D) configuration, high aspect ratio, and remarkable thermal conductivity (3000 W/(m K) for individual multiwall carbon nanotubes (MWCNTs) and 200 W/(m K) for bulk multi-walled CNTs at room temperature). Possessing these properties, MWCNTs represent a promising high thermal conductivity filler, similar to AlN [
41,
42,
43,
44]. While pure silicone rubber typically possesses a low thermal conductivity (0.1–0.3 W/(m K)), both corrosion resistance and thermal conductivity significantly improve when filled with high thermal conductivity ceramic powders [
24]. This improvement in properties expands its range of applications. The blending with CNTs has demonstrated increased thermal conductivity and reduced the required filler content in a composite, including those with ceramic fillers such as AlN and CNTs [
20,
41]. However, the simultaneous integration of ceramics, such as AlN and CNTs can be complicated. In addition, the difficulty of AlN stabilization (water resistance) persists, and the presence of non-contributing CNTs within thermal pathways can potentially trigger a decline in mechanical properties due to the need for increased filler content (
Figure 1c).
We have previously reported the success synthesis of vertically aligned CNTs on AlN flat substrates using water-assisted chemical vapor deposition (CVD), “super-growth method” [
45]. The commonly used vapor phase deposition of Fe catalyst is not suitable for the deposition of spherical particles as shown in
Figure 1. In this paper, we present a new strategy to reduce the filler content of AlN and improve the water resistance of AlN: CNT/AlN filler, in which CNTs are grown on AlN particles used as a thermal conductive filler, as shown in
Figure 1d. Specifically, we have focused on the application of Fe catalyst coating methods to both AlN filler particles and CNT synthesis processes. In this pursuit, we have used wet-based catalyst coating techniques, in particular dip coating and vacuum filtration coating, to coat AlN particles with the Fe catalyst. We then proceeded to vertically grow CNTs directly on the AlN particles, a step aimed at improving the water resistance of AlN. In addition, we demonstrate the exceptional properties of this CNT/AlN composite as a thermally conductive filler in silicone rubber matrices. By creating efficient thermal conduction pathways within the matrix, as shown in
Figure 1d, we increased thermal conductivity at reduced filler content. For this purpose, we directly mixed CNT/AlN particles with the silicone rubber. In the process of this study, we have successfully exercised precise control over the structural properties (length and number of layers) of the synthesized CNTs. This was made possible by meticulously adjusting the catalyst coating conditions applied to AlN particles and regulating the CNT synthesis duration through a straightforward methodology. Moreover, by integrating the synthesized CNT/AlN filler with silicone rubber, we have achieved about twice the thermal conductivity of AlN alone at about half the filler addition rate, while maintaining the mechanical properties of rubber. This was evident when compared with previous reports involving other strategies of AlN-based composites either in isolation or in conjunction with CNTs.