TY  - GENERIC
DO  - 10.20944/preprints202409.0077.v1
UR  - http://dx.doi.org/10.20944/preprints202409.0077.v1
TI  - Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications
T2  - Preprints
AU  - Wadhwa, Arjun
AU  - Saadati, Mohammad
AU  - Benavides Guerrero, Jaime
AU  - Bolduc, Martin
AU  - Cloutier, Sylvain G
PY  - 2024
DA  - 2024/09/03
PB  - Preprints