TY  - GENERIC
DO  - 10.20944/preprints202410.0657.v1
UR  - http://dx.doi.org/10.20944/preprints202410.0657.v1
TI  - A Comprehensive Microstructure-Aware Electromigration Modelling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
T2  - Preprints
AU  - Saleh, Ahmed Sobhi
AU  - Croes, Kristof
AU  - Ceric, Hajdin
AU  - De Wolf, Ingrid
AU  - Zahedmanesh, Houman
PY  - 2024
DA  - 2024/10/10
PB  - Preprints