Cu₆Sn₅ whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag₃Sn fibers can be observed around Cu₆Sn₅ whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu₆Sn₅ whiskers can be observed, and hexagonal rod structure is the main morphology of Cu₆Sn₅ whiskers. A hollow structure can be observed in hexagonal Cu₆Sn₅ whiskers, and a screw dislocation mechanism was used to represent the Cu₆Sn₅ growth. Based on mechanical property testing and finite element simulation, Cu₆Sn₅ whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer.