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Incorporation of Horizontal Fins into a PCM-Based Heat Sink to Enhance the Safe Operation Time: Applicable in Electronic Device Cooling

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Submitted:

10 July 2020

Posted:

11 July 2020

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Abstract
In this study, the thermal behavior of a PCM-based heat sink in the presence of horizontal fins was numerically investigated. These types of heat sink can be effective in electronic cooling applications. Independent variables included aspect ratio (AR), number of horizontal fins (n) and their length (LR), while the objective function was defined to maximize the safe operation time (tmax). The incorporation of horizontal fins has a positive effect (thermal conductivity enhancement) as well as a negative effect (latent heat reduction). Based on the results, the optimal number of horizontal fins was five. As the number of fins rises up to five, the incremental effect of thermal conductivity improvement (positive effect) was superior to the decremental effect of the latent heat reduction (negative effect), hence the objective function (tmax) improved. However, with a further increase in the number of fins upon five, the negative effect prevailed over the positive effect and therefore the safe operation time diminished.
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Subject: Engineering  -   Mechanical Engineering
Copyright: This open access article is published under a Creative Commons CC BY 4.0 license, which permit the free download, distribution, and reuse, provided that the author and preprint are cited in any reuse.
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