Multi-wire saw machining (MWSM) used for slicing hard-brittle materials in semiconductor, is an important material removal process that uses free abrasives. Cutting model of single-wire saw machining (SWSM) is the basis of MWSM, and the material removal mechanism of SWSM can better understand than MWSM. Mathematical model (includes brittle fracture and plastic deformation) is presented in this paper for SWSM ceramic with abrasives. This paper determines the effect of various machining parameters on the removal of hard-brittle materials. For brittle fracture of SWSM ceramics, the minimum of the strain energy density is used as a fracture criterion. The material removed of SWSM ceramics due to plastic deformation is calculated using the equations of motion. Actual wire-sawing experiments are conducted to verify the results from the developed mathematical model. Theoretical results agree with experimental data and practical experience. The developed mathematical model shows that brittle fracture plays a major concern role in material removed of SWSM ceramics. Wire speed and working load have positively correlated with material removed of SWSM ceramics. The coefficient of friction is low, a lateral crack, which propagates almost parallel to the working surface, leads to more brittle fracture and material removed is increased on SWSM ceramics.