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Thickness Measurement of Circular Metallic Film Using Single-Frequency Eddy Current Sensor

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Submitted:

08 February 2021

Posted:

09 February 2021

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Abstract
In many advanced industrial applications, the thickness is a critical index, especially for metallic coatings. However, the variance of lift-off spacing between sensors and test pieces affects the measured voltage or impedance, which leads to unreliable results from the sensor. Massive research works have been proposed to address the lift-off issue, but few of them applies to the thickness measurement of planar metallic films with finite-size circular (disk) geometry. Previously, a peak-frequency feature from the swept-frequency inductance was used to compensate the measurement error caused by lift-offs, which was based on the slow-changing rate of impedance phase term in the Dodd-Deeds formulas. However, the phase of measured impedance is nearly invariant merely on a limited range of sample thicknesses and working frequencies. Besides, the frequency sweeping is time-consuming, where a recalibration is needed for different sensor setups applied to the online real-time measurement. In this paper, a single-frequency algorithm has been proposed, which is embedded in the measurement instrument for the online real-time retrieval of thickness. Owing to the single-frequency measurement strategy, the proposed method does not need to recalibrate for different sensor setups. The thickness retrieval is based on a triple-coil sensor (with one transmitter and two receivers). The thickness of metallic disk foils is retrieved from the measured electrical resistance of two transmitter-receiver sensing pairs. Experiments on materials of different electrical conductivities (from direct current), thicknesses and planar sizes (radii) have been carried out to verify the proposed method. The error for the thickness retrieval of conductive disk foils is controlled within 5 % for lift-offs up to 5 mm.
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Subject: Engineering  -   Automotive Engineering
Copyright: This open access article is published under a Creative Commons CC BY 4.0 license, which permit the free download, distribution, and reuse, provided that the author and preprint are cited in any reuse.
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