The liquid droplet cooling technique for fast scanning chip calorimetry (FSC) is introduced, increasing the cooling rate for large samples on a given sensor. Reaching higher cooling rates and using a gas as the cooling medium, the common standard for ultra-fast temperature control in cooling, requires reducing the lateral dimensions of the sample and sensor. The maximum cooling rate is limited by the heat capacity of the sample and the heat exchange between the gas and the sample. The enhanced cooling performance of the new liquid droplet cooling technique is demonstrated for both metals and polymers, on examples of solidification of large samples of indium, high-density polyethylene (HDPE), and poly (butylene 2,6-naphthalate) (PBN). It was found that the maximum cooling rate can be increased up to 5 MK/s in room temperature environment, that is, by 2 orders of magnitude, compared to standard gas cooling. Furthermore, modifying the droplet size and using coolants at different temperatures provide options to adjust the cooling rate in the temperature ranges of interest.