Our second strategy to improve the performance of graphene-based PDLC devices was to employ the WIIC process to remove impurities at the interface between the TCE and substrate. We propose that the WIIC process offers two advantages. First, the TCE was uniform throughout the study area. Second, it improved the adhesion between the TCE and the substrate. Uniformity was already revealed when the sheet resistance was measured. The sheet resistance of 4LG without and 4LG with WIIC were 49±4 Ω/ and 57±2 Ω/, respectively. The standard deviation of the sheet resistance of 4LG with WIIC was half that of 4LG without WIIC. To confirm the uniformity of 4LG o on a large scale, we performed 4-point mapping for a 200 mm × 200 mm area of 4LG with and without WIIC, as depicted in
Figure 3a,b. A sheet resistance value of 58±2 Ω/sq is observed for the 4LG with WIIC process, which is slightly higher than the value of 51±5 Ω/sq obtained for 4LG without WIIC process. This result is consistent with the Hall measurements. Although the sheet resistance increased because of the WIIC procedure, the entire area had a uniform sheet resistance value. The elimination of impurities, as indicated by the white circle in
Figure 3a, may be responsible for this. The effect of the WIIC process is further supported by the on/off optical images shown in
Figure 4a,b. The optical image of the PLDC device with a 4LG electrode without the WIIC process at an applied voltage is unclear and shows the graphene-burning phenomenon resulting from the high power consumption of graphene [
30,
31], as marked by the blue circle in
Figure 4a. Because of the current crowding induced by impurities and adhesion between the graphene and the substrate at 60 V injection, an excessive quantity of power builds up under the graphene electrode in the device, destroying the graphene with Joule heat. As illustrated in
Figure 4b, in the case of the 4LG electrode following the application of the WIIC process, the device in the ON state was nearly transparent and uniform across the entire operation region. This clearly indicates that the 4LG electrode with the WIIC process as a transparent conductive layer can act as an efficient lateral current diffusion channel. The WIIC process effect can be evaluated using the above results obtained from the PDLC device, but the adhesion between the 4LG electrode and the substrate could not be verified. To confirm whether the WIIC process was capable of enhancing the adherence of the 4LG electrode to the substrate, we fabricated patterned graphene using photolithography and etching over a large area of 200 mm × 200 mm, as shown in
Figure 5a. To form patterned graphene, the CVD-grown graphene films were transferred four times onto a glass substrate. Thereafter, the patterned region was covered with a protective photoresist (PR) as an etchant mask and graphene was patterned using an inductively coupled plasma reactive-ion etcher with O
2 plasma. Finally, the PR was removed using acetone.
Figure 5b and c show the optical images of the patterned graphene without and with the WIIC process, respectively. The surface of patterned graphene without a WIIC process is readily and partially peeled-off during fabrication owing to the lack of chemical reactivity of graphene, which consists of the C-C bond of sp
2 hexagonally arranged carbon atoms with no dangling bonds [
20,
21,
22,
32]. When the WIIC process was applied, we observed a cleanly patterned graphene surface without peeling. This is as a result of the fact that the adhesion of graphene to the substrate was stronger than its attachment to the PR, which is indicative of enhanced adhesion.