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Effect of Y Addition on the Microstructures and Tensile properties of Sn-Bi-Al Alloys
Version 1
: Received: 10 October 2023 / Approved: 11 October 2023 / Online: 11 October 2023 (10:51:00 CEST)
How to cite: Esteves, J. L. N.; Zhang, X. Effect of Y Addition on the Microstructures and Tensile properties of Sn-Bi-Al Alloys. Preprints 2023, 2023100680. https://doi.org/10.20944/preprints202310.0680.v1 Esteves, J. L. N.; Zhang, X. Effect of Y Addition on the Microstructures and Tensile properties of Sn-Bi-Al Alloys. Preprints 2023, 2023100680. https://doi.org/10.20944/preprints202310.0680.v1
Abstract
Compared to tin lead alloys, lead-free tin alloys have lower toxicity, making them more widely used. In this study, Sn-20Bi-0.3Al-xY solders alloys were prepared. The effects of the addition of Y on its microstructure, micro-hardness, wettability and mechanical properties was investigated. The result showed that the addition of Y had significant effect on the refinement of Sn-20Bi-0.3Al-xY. From the spreading tests results, Y increased the wettability of the solders, however when the fraction of Y gradually increased, the wettability reduced. The ultimate tensile and hardness of Sn-20Bi-0.3Al-xY solders alloys were increased as the content of Y increasing.
Keywords
Lead-free solder; Sn-20Bi; wettability; mechanical properties; microstructure
Subject
Chemistry and Materials Science, Metals, Alloys and Metallurgy
Copyright: This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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