The miniaturizing of devices can be dated as far back as the Stone Age. The focus is to make most systems become as small as possible [
5]. This also applies to sensors as
in vivo and
in vitro monitors of biological signals. The breakthroughs in manufacturing microsystems further paved the way for biomedical sensors, classified under miniaturization, elastic nature, and design [
6]. This implies a biosensor must be small, have an elastic modulus compatible with the human tissue, and must have the ability to be customized based on its functions. Available biomedical sensors in their small size are tactile sensors, microfluidic devices, diagnostic devices, biomarkers for diseases, and microelectrode-based electronic probes. The complexity of making micro and nanoscale devices started with etching on glass, which was later replaced with a silicon (Si) wafer [
7]. Known for its outstanding characteristics over glass, Si wafer lithography has grown to a larger scale. Soft lithography uses an elastomeric polymer called polydimethylsiloxane (PDMS) to fabricate devices for various applications [
8,
9,
10]. In contrast to glass and silicon, PDMS has a low elastic modulus (300–500 Kpa) and is permeable to gas, making it one of the best-fit materials as a biosensor [
6]. The limitations of soft lithography include but are not limited to sophisticated processes (combined with photolithography), multiple stages, high professional experience, incompatibility with some reagents, and susceptibility to swelling while in contact with organic solvents [
11]. Also, making a 3D structure is a significant setback in photo-soft lithography. A possible way is to stack several layers of 2D devices to form a 3D device [
12]. Unfortunately, this approach is time-consuming and unreliable. The inception of 3D printing brought about a significant milestone in several fields and applications of microsystems, including microfluidics, biosensors, and biomedicine [
13,
14,
15]. Three-dimensional (3D) printing, also known as additive manufacturing (AM), involves the layer-by-layer formation of an object to form a 3D structure. This process relies on extruded, deposited, or solidified materials under certain conditions in making the required object [
16]. The American Society for Testing and Materials (ASTM) classified AM techniques based on their mode of operation into seven categories, which include powder bed fusion (PBF), vat polymerization, extrusion, material jetting, binder jetting, sheet lamination, and directed energy deposition (DED) [
17].