1. Introduction
Carbon fiber-reinforced polymers (CFRPs) have become an established part of aviation and space industry. Their advantages over metallic materials, particularly in terms of fatigue behavior, cause them to be frequently preferred in recent developments. However, in contrast to metallic materials, fiber-reinforced composites exhibit very complex failure behavior, involving a wide range of damage modes that are dependent on a large number of factors [
1,
2,
3,
4].
In aerospace, safety is of highest importance. As a consequence, components made from fiber-reinforced composites are often designed with a higher material input than necessary, to include unknown design variables and unforeseen damage mechanisms. This more conservative layout results in more fail-safe components, but is in conflict with traditional lightweight design concepts, as the increased use of material adds additional weight [
5]. This additional material input increases the fuel consumption or decreases the payload [
6,
7]. As stated by Flower and Soutis [
8] a reduction of 1% mass could save nearly 3000 liters of fuel per year (analyzed for single aisle aircrafts).
Especially in commercial aviation, very high standards for safety and reliability are established, which have to be warranted and guaranteed throughout the service life of an aircraft. For this purpose, the manufacturers specify appropriate maintenance and service schedules, which have to be fulfilled by the operators. These rules also specify relevant inspection methods as well as the location for these inspections. In the case of CFRPs, ultrasonic testing is a well-established and commonly used method for a more in-depth inspection for potential damage locations. However, ultrasonic testing is time consuming, and thus, the aircrafts experience long and often unnecessary downtimes [
2,
9,
10,
11].
A comparatively novel and widely discussed approach to reduce these downtimes is structural health monitoring (SHM), which monitors the condition of a structural component continuously while an aircraft remains in operational service [
2,
11,
12,
13,
14]. Numerous SHM methods are developed so far and can be classified into methods that actively excite a structural response or methods that use other sources of excitation, like e.g., mechanical loading. Different methods use, e.g., ultrasonic wave propagation or mechanical strains, for damage evaluation [
14,
15,
16,
17,
18,
19,
20,
21]. Another method is the EIT-based reconstruction of the spatial conductivity of an area of interest. This method may be of particular interest for large thin-walled and shell-shaped components, as it uses the mechanical structure itself (if conductive in the right magnitude, e.g., CFRP [
22,
23]) or a thin conductive coating applied onto the structure as a sensor. However, to overcome the challenges associated with direct contacting CFRP laminates and the underlying anisotropic electrical behavior, a conductive coating used as thin-film sensor is often preferred. These thin-film sensors are equipped with electrodes that are placed at their boundaries. The EIT method evaluates the sensor’s spatial conductivity by the electrical potential at the boundary electrodes due to systematic excitation by a defined current pattern. Thus, EIT featuring thin-film sensors can be used to evaluate damages [
22,
24,
25,
26], that change the conductivity of the covering thin-film.
Besides these damages that result in very large conductivity drops, recent investigations demonstrated that EIT can also be used to approximate mechanical strains. Tallman et al.[
27] performed an inverse determination of strains. They applied an analytical piezoresistivity model with which the displacement field and the strains were derived, while the difference between experimentally determined conductivity and the conductivity of the analytical piezoresistivity model was minimized. A similar investigation was carried out by Lynch et al.[
28], where carbon nanotube-based sensing skins applied on metallic specimens were utilized to identify spatial strain and impact damage. Another research was conducted by Hassan [
29], where a generic algorithm and EIT analysis was used to evaluate conductivity changes induced by stress concentrations. The samples used in their research were weakened by a circular hole and subjected to static tensile loads. Validation through digital image correlation (DIC) and numerical simulations demonstrated accuracy of this proposed model. However previous research has typically used small specimens and has not investigated their sensor networks or evaluation methods under realistic operational loading conditions, nor for the corresponding damaging behavior.
The present paper investigates the potential of the EIT method featuring conductive thin-film sensors for damage initiation and propagation in CFRP components under fatigue loading. Therefore, a thin-walled plate-shaped plain-woven CFRP specimen with a centrally placed circular hole is considered and damage induced and propagated by sinusoidal tension-tension loading is examined. During experimental testing, load amplitude adjustments are done to investigate the effect on the damage propagation, as well as on the applied thin-film sensor and the EIT damage evaluation results. Accompanying 3D-DIC evaluations of the plate surface provide validation for the EIT results. The novelty of this investigation lies on the operational loading conditions and the consequently required compensation of fatigue loading induced changes to the sensor (e.g. “Set-In” effect [
30] and potential environmental influences). On the basis of the EIT measurements collected throughout the fatigue loading, two damage evaluation approaches are proposed, with which changes to the sensor can be compensated.
The article is structured as follows. First the preparation of the specimen, the experimental procedure, and the damage evaluation approaches (3D-DIC and EIT) are described. The damage evaluation results by the 3D-DIC and the EIT reconstructions are presented afterwards. Finally the results are discussed and conclusions are made.
4. Discussion
The damage induced by the cyclic fatigue loading is evaluated by measurements taken in the quasi-static loadings. As evaluations of the spatial surface strain field by 3D-DIC reveal, degradation in the vicinity of the hole occurs, providing an indication of existing damage. While
Figure 5 show this degradation for isolated cases, visualization of the degradation throughout the entire cyclic fatigue loading is achieved with a threshold value (see
Figure 6). To identify the shape and size of the underlying damage with 3D-DIC, the correlation coefficient is used. The resulting path (determined with a threshold value), given in
Figure 8 serves as a qualitative comparative quantity for the EIT evaluations.
This path, obtained by the 3D-DIC correlation coefficient, reveal damage initiation at the edge of the circular hole within the first 2k cycles (see detail
Figure 8). This observation is in agreement with previous findings of the authors [
34], where detailed focus was placed on damage initiation and propagation of similar specimens subjected to a single cyclic loading amplitude. The adopted threshold value also shows a comparative damage size at 500k cycles. Thereafter, the load dependency of the correlation confidence is present. Meaning that the arising delaminations and micro-cracks induced by higher cyclic loadings are not fully opened within the quasi-static loading, where the evaluation takes place. Thus, implying that the actual size of the damage is larger than that obtained from 3D-DIC evaluation. Nevertheless, the tendency of damage progression is still present throughout the cyclic fatigue loading.
Before the results of the 3D-DIC evaluations and the EIT reconstructions are compared, the results of the EIT reconstructions are verified to ensure that they are not due to degradation of the sensor itself. Therefore the baseline measurements
are examined individually to obtain the mean spatial conductivity of the sensor. In
Figure 13 the mean spatial conductivity of the sensor is plotted over the number of cycles.
At the initial 70k cycles the “Set-In” effect is evident. Owing to this strong initial conductivity change, there is also no precise identification of the damage initiation, since it occurs within the first 2k cycles as indicated by the 3D-DIC evaluation. Likely the small extent of the damage at initiation may also influence the detectability, meaning that an evaluation by means of EIT may be possible only for damage above a certain size. After the “Set-In” effect, it appears that the conductivity of the sensor remains relatively stable and allows the evaluation of damage progression. Additionally, this indicates the suitability of the used thin-film sensor material for this application and that the obtained results are primarily attributable to spatial conductivity changes, caused by e.g. potential damage. After 1750k cycles the spatial conductivity of the sensor starts to increase, indicating a possible degradation of the sensor. However, further investigations are required to obtain more detailed information about the service life of the used sensor.
The first proposed approach, given in
Section 2.4.1 deals with the compensation of the strong initial conductivity change (“Set-In” effect). Results given in
Figure 9 and
Figure 10 are obtained by referring EIT measurements taken at the same load level but at different cycles to an initial measurement (i=1). Consequently, environmental influences (e.g. humidity and temperature) which may occur are not accounted within this approach. Nevertheless, as these environmental influences remained stable throughout the experiment, they are not influencing the results.
Using the area of spatial conductivity changes from
Figure 10 and scale them to reflect the normalized damage size from the 3D-DIC evaluation at 1500k cycles allows a common representation. In
Figure 14 the EIT reconstructions (also presented in
Figure 10) and the 3D-DIC evaluation (also presented in
Figure 8) are given, to validate the outcome of the EIT reconstructions.
This common representation reveals that the spatial conductivity changes correlate very well with the 3D-DIC outcomes. Comparing the 3D-DIC results with those of the EIT reconstructions at peak load
yields a significantly stronger agreement than with those at mean load
. Up to 1500k cycles both EIT reconstructions show satisfactory agreement, beyond this cycle number the differences between 3D-DIC and EIT become larger. This may indicate a deterioration of the thin-film sensor, which is also supported by the mean spatial conductivity change given in
Figure 13. This also explains the scaling of the EIT reconstructions at 1500k cycles. Nevertheless, both comparisons emphasize that EIT reconstructions can also be used to evaluate the damage progression, to the extent that the initial strong conductivity change is taken into account, as shown in the proposed approach.
The second approach to enable EIT-based fatigue damage monitoring by compensation of the “Set-In” effect and further potential environmental influences uses a continuous reference measurement adjustment. Here, the baseline measurement
is updated and subsequent measurements at peak load
and mean load
are referred to these. Thereby, evaluated spatial conductivity changes are the result of a superposition of mechanical loading and potential damage. Results presented in
Figure 12 reveal an increase of the damage affected area over the number of fatigue cycles. Using these results and scale them in accordance with the normalized 3D-DIC results from
Figure 8 provides a combined representation, as given in
Figure 15. Again the 3D-DIC result at 1500k cycles is used for scaling of the EIT results. In
Figure 15 (a), the 3D-DIC evaluations are plotted besides the EIT reconstructions of the
to
evaluations. In
Figure 15 (b), the 3D-DIC evaluations are plotted besides the EIT reconstructions of the
to
evaluations.
It can be seen that the propagation of the damage affected area evaluated by EIT qualitatively correlate with the results from the 3D-DIC. However, some noticeable differences are apparent. Existing differences as given in
Figure 15 are attributable to certain aspects. Particular, the discrepancies may be explained by the fact that the spatial conductivity changes are derived from measurements at different load levels, which gives a combination of mechanical loading and potential damage. Likewise, the applied primer, on which the thin-film sensor has been deposited, may additionally blur the strains and local changes within the spatial strain field, which are not detected by the EIT reconstruction might also induce such differences. A further aspect is the choice of the conductivity change thresholds for damage detection. Although a reduction of these threshold values improved the sensitivity, it also led to a significantly higher noise detection. Therefore, the choice provided the best trade-off between accuracy and robustness.
All these aspects are also reflected in the first proposed approach, except the evaluation at different load levels. However, as shown in
Figure 14, the differences between 3D-DIC and EIT reconstructions are considerably smaller, indicating that these aspects may have a minor contribution to the observed differences as can be seen in
Figure 15. Consequently, the evaluation at different loads levels and the use of an updated baseline measurement
is likely to have a more significant contribution to the differences.
Compared to the first proposed approach, the agreement of the second proposed approach with the results of the 3D-DIC is weaker. However, the second approach could compensate a potential inhomogeneous “Set-In” effect (or inhomogeneous temperature and moisture distributions). This is particularly advantageous for significantly enlarged sensors (e.g. for application on complete shell-shaped structures) in the case that inhomogeneity is present. In the absence of any inhomogeneity related to the “Set-In” effect, the first proposed approach could also be used for significantly larger sensors.
Nevertheless, both proposed approaches demonstrate that progressive damage can be evaluated. While the 3D-DIC evaluates the entire evaluation area, the EIT uses voltage measurements at the boundary to reconstruct the electrical conductivity within the thin-film sensor. Consequently, the resulting resolution of the EIT reconstructions is smaller. Both methods rely on local changes within the evaluated area. It is likely that strain changes due to delaminations and micro-cracks caused by cyclic loading are responsible for the detected local changes. Using 3D-DIC, the delaminations and micro-cracks result in changes to the subsets (change of the gray value) and hence allow an evaluation, as the correlation coefficient passes the defined threshold value. Within the EIT reconstructions, delaminations and micro-cracks deteriorate the local conductivity, allowing an evaluation. Despite the fact that opposite sides (3D-DIC on backside, EIT on frontside) are evaluated, it is assumed that the occurring damage is reflected identically on both sides.
In common, to enhance the findings through EIT reconstructions and to obtain better agreement between EIT and 3D-DIC the following considerations can be included. During the experiment, a single EIT measurement was performed at each load level. Several EIT measurements offer a possibility to identify potential outliers and the possibility of averaging the reconstructed spatial conductivity changes. In addition, a reduction in the size of the thin-film sensor or additional electrodes could be considered for improved spatial resolution. Both of these aspects would ensure that more information for the spatial reconstruction is available and, as a result, a more accurate evaluation could be carried out. Furthermore, a higher order reconstruction approach could be used like e.g., the generic algorithm according to Hassan[
29]. Additionally, for the second proposed approach, a load independent analysis may be possible to compensate the mechanical loading component in the spatial conductivity change, so that only potential damage remains as a quantity. This may be achieved by a profound analysis of the elastoresistive properties and its dependency on fatigue loading. However, this is left for future research.
4.1. Conclusions
The present study demonstrates the potential of the EIT method featuring a spatial elastoresistive thin-film sensor for the monitoring of damage initiation and propagation in a cyclic fatigue loaded thin plain-woven CFRP component. As a case study, a CFRP plate with a centrally placed circular hole, that is subjected to high cyclic tensile-tensile loading, is used. The applied strains were between and , thus, well represent a realistic operational loading of CFRP components, leading to realistic damage. The observed damage is a multiple delamination in combination with micro-cracks that initiates and propagates at both sides of the hole. For validation of the EIT results a 3D-DIC system is used, to monitor the shape and size of the damage. The electrical contacts at the used thin-film sensor did not show any visible deterioration. However, the thin-film sensor material showed a strong “Set-In” effect, followed by very constant electrical properties until it seemed to in increasingly deteriorate over 1500k cycles. Consequently, the sensor network is concluded to be applicable for the monitoring of operational fatigue loading. Nevertheless, it is required to compensate this “Set-In” effect for fatigue, and therefore, realistic operational loading regimes. Two compensation approaches are proposed in the present article. The first, uses a conductivity mean value adaptation and provides a very good correlation with the damage propagation identified by the 3D-DIC system. The second approach also demonstrates potential to monitor damage propagation by EIT, however, the superimposition of mechanical loads and potential damage corrupts the correlation.
Due to the nature of the used EIT reconstruction algorithm, the true shape of the damage cannot be identified, and thus, also not directly correlated to the 3D-DIC results. For the evaluation if a damage at a location is present or not, a threshold is used. The damage propagation is observed by summation of these damage affected local areas. The damage locations identified by the EIT approaches perfectly match the 3D-DIC results. Furthermore, it is highly expected that more advanced reconstruction algorithms also enable the evaluation of the damage shape.
Future research shall address the characterization of the influence of the fatigue loading on the sensor material’s elastoresistivity, and furthermore, the identification of the true damage shape and the full spatial strain state by more advance EIT reconstruction algorithms to enable a better evaluation of the damage within the composite layup and its effect on the integrity of the structural component.
Nevertheless, it has been demonstrated within this paper that both proposed EIT approaches, which compensates EIT related issues, can be used to describe damage progression originating from a circular hole due to cyclic fatigue loading at multiple loading levels. Consequently, the use of thin-film sensors offers a complementary method, with which damage propagation of thin plain-woven CFRP laminates with a circular hole could be evaluated.
Figure 1.
Geometry and dimensions of the plate with hole, location of the GFRP tabs, thin-film sensor with electrodes and cabling, and speckle pattern for 3D-DIC evaluation.
Figure 1.
Geometry and dimensions of the plate with hole, location of the GFRP tabs, thin-film sensor with electrodes and cabling, and speckle pattern for 3D-DIC evaluation.
Figure 2.
Experimental setup.
Figure 2.
Experimental setup.
Figure 3.
Tabular list of the loading details along with a schematic representation of a loading sequence i consisting of a single quasi-static loading for EIT and 3D-DIC damage evaluation and cyclic fatigue loading to provoke damage initiation and propagation.
Figure 3.
Tabular list of the loading details along with a schematic representation of a loading sequence i consisting of a single quasi-static loading for EIT and 3D-DIC damage evaluation and cyclic fatigue loading to provoke damage initiation and propagation.
Figure 4.
Positioned evaluated area, magnified detail to visualize the subset size and associated settings.
Figure 4.
Positioned evaluated area, magnified detail to visualize the subset size and associated settings.
Figure 5.
3D-DIC evaluated major principal strain 1 at different cycles (evaluated from to ).
Figure 5.
3D-DIC evaluated major principal strain 1 at different cycles (evaluated from to ).
Figure 6.
Normalized changes in the spatial surface strains (major principal strain ) versus the test length for to from 3D-DIC evaluations.
Figure 6.
Normalized changes in the spatial surface strains (major principal strain ) versus the test length for to from 3D-DIC evaluations.
Figure 7.
3D-DIC evaluation results for with respect to . The defined correlation confidence threshold reveals the damage shape and size (red region).
Figure 7.
3D-DIC evaluation results for with respect to . The defined correlation confidence threshold reveals the damage shape and size (red region).
Figure 8.
Normalized 3D-DIC evaluated damage size for quasi-static load level with respect to over the number of cycles.
Figure 8.
Normalized 3D-DIC evaluated damage size for quasi-static load level with respect to over the number of cycles.
Figure 9.
Spatial conductivity changes at peak load for selected cycles.
Figure 9.
Spatial conductivity changes at peak load for selected cycles.
Figure 10.
Area of conductivity changes below threshold value over the number of cycles for to and to .
Figure 10.
Area of conductivity changes below threshold value over the number of cycles for to and to .
Figure 11.
EIT reconstructions of the spatial conductivity changes at different cycles (evaluated from to ).
Figure 11.
EIT reconstructions of the spatial conductivity changes at different cycles (evaluated from to ).
Figure 12.
Damage affected area over the number of cycles for to and to EIT reconstructions.
Figure 12.
Damage affected area over the number of cycles for to and to EIT reconstructions.
Figure 13.
Mean spatial conductivity of the thin-film sensor for evaluations, indicating the “Set-In” effect at the beginning and a stable sensor conductivity up to 1750k cycles.
Figure 13.
Mean spatial conductivity of the thin-film sensor for evaluations, indicating the “Set-In” effect at the beginning and a stable sensor conductivity up to 1750k cycles.
Figure 14.
3D-DIC-based validation of EIT-based damage evaluation results using mean value adjustment for, (a) to , and (b) to .
Figure 14.
3D-DIC-based validation of EIT-based damage evaluation results using mean value adjustment for, (a) to , and (b) to .
Figure 15.
3D-DIC-based validation of EIT-based damage evaluation using continuous reference adjustment for, (a) to , and (b) to .
Figure 15.
3D-DIC-based validation of EIT-based damage evaluation using continuous reference adjustment for, (a) to , and (b) to .
Table 1.
Curing properties of the individual components in the order of application.
Table 1.
Curing properties of the individual components in the order of application.
Designation |
Temperature in °C |
Time in h |
DeSoto 512X310 Epoxy Primer |
RT |
2.5 |
Desothane HS CA8800 Topcoat |
RT |
90 |
SunChemical C2130819D1 Carbon Paste |
60 |
0.5 |
3M™ Scotch-Weld™ DP490 |
60 |
2 |
ELECTROLUBE Silver Conductive Paint |
RT |
0.2 |
EPO-TEK H20E |
80 |
3 |
LOCTITE EA9466™ |
80 |
0.5 |