This version is not peer-reviewed.
Submitted:
17 November 2024
Posted:
19 November 2024
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RF signals are widely used in various applications such as telecommunications, wireless communication systems, and radar systems. These signals can be manipulated using phase shifters that adjust the signal's phase. This adjustment is essential for beam shaping, signal cancellation, and frequency synthesis in antenna arrays. By controlling the phase of the RF signal, phase shifters help manipulate electromagnetic waves for various applications. Therefore, as Gallo points out, phase shifters are essential for manipulating and controlling high-frequency signals. This manipulation and control is essential to improving the performance of wireless communication and radar systems and can improve signal reception and transmission.The study examines different types of phase shifters, conducts a comparative analysis of different phase shifter topologies and technologies, and highlights their respective advantages and limitations in applications. In addition, the review includes a specific study of liquid metal phase shifters. Finally, the article outlines future research directions for liquid metal phase shifters, It emphasizes the need for innovative design strategies to keep pace with the evolving wireless communications and telecommunications fields. Therefore, this article can serve as a reference for the milestones in RF phase shifter research.
1 | Insertion Loss |
2 | Return Loss |
3 | Single-Unit Two-Bit Reflection-Type Phase Shifters |
4 | Switched-Type Phase Shifters |
5 | Reflective-Type Phase Shifters |
6 | Loaded-Transmission Line Phase Shifters |
7 | Vector-Sum Phase Shifters |
8 | Root Mean Square |
Types | Benefits | Limits | References |
---|---|---|---|
Active phase shifters | -Lower insertion losses - Architecture simple -Compact geometry -Low cost for silicon surface area. |
-Their DC consumption is higher - The linearity is degraded - The transmission power is limited |
[5,52] |
Passive phase shifters | - Reduces DC consumption - Improves linearity. |
-The circuits are less compact. Insertion losses are higher |
Reference | Shift Method | Control Type | Frequency(GHz) | IL 1(dB) | RL2(dB) | (°) |
---|---|---|---|---|---|---|
[54] | Switched line | Digital | 13-18 | 2.7 | 22 | 349.3 |
[55] | Reflection type | Analogue | 2 | 1 | 13.4 | 385 |
[56] | Network type | Digital | 0.5-1 | 2.5 | 13 | 360 |
[2] | Loaded transmission line | Analogue | 1 | 2 | 15 | 183 |
[57] | GFET CS Amplifier | Digital | 3 | -2.5 | 0.9 | 197.9 |
[57] | GFET CS Amplifier | Analogue | 3 | 0 | 0.4 | 84.5 |
[32] | RTPS | Digital | 1.37-1.43 | 2.3 | >15 | 180 |
[58] | Schiffman | Digital | 1.5-6 | 1.2 | > 10 | 323 |
[59] | Inverted-E | Digital | 0.4-4 | 0.46-1.8 | > 12->15 | 100 |
[60] | SUTBRTPSs3/single-unit | - | 0.9-1.1 | 2.1 | > 19 | 180 |
Performance | STPS 4 | RTPS 5 | LLPS 6 | VSPS 7 |
---|---|---|---|---|
Bandwidth | Narrow | Narrow | Narrow | Wide |
Passive/Active | Passive | Passive | Passive | Active |
Phase control | Digital | Analog/Digital | Analog/Digital | Analog/Digital |
Power consumption | Low | Low | Low | High |
Chip area | Large | Large | Large | small |
Linearity | High | High | High | Limited |
Output power | High | High | High | Low to medium |
Insertion loss | High | High | High | Low |
Return loss | Medium | High | Low | High |
References | Phase Shifters Type | Benefits | Limits |
---|---|---|---|
[54,55,60] | Ferrites | -High power-handling capacity -Decent reliability -Radiation tolerance -Suitability for high-power applications |
-They are bulky -less integratable -Slow in response (requiring long tuning times) -Expensive (not suitable for mass production) -Significant power consumption |
[57,58] | p-i-n diodes, Varactors | -Offers continuous tunability of the output phase -maintains satisfactory isolation and reflection coefficients -Simple, easy to manufacture -Low cost |
-Limited phase-shift resolution - Unacceptably high losses in the millimetre-wave band |
[59,60] | MEMS | -Significantly lower insertion loss -Higher linearity over wide bandwidth -Lower power consumption compared to semiconductor technologies |
-Still limited by the maximum operational frequency -Reliability issues |
[58,59] | Tunable Dielectrics Methods | -Easy implementation and control. -Low insertion -High phase resolution -High tunability -Small phase deviation with frequency and linear phase tuning. |
-complex configurations -Expensive -High power consumption |
[61,62] | Liquid crystal (LC) materials | -low insertion loss (IL) at higher frequencies. -They offer a wide phase tuning range -High phase resolution |
-The phase shifting range of some LC-based designs is limited -Slower switching speed compared to semiconductor- based solutions . |
Property | Mercury | Gallium | EGaIn (Ga 75%, In 25%) |
Galinstan® | Generic galinstan (Ga 68.5%, In 21.5%, Sn 10%) |
---|---|---|---|---|---|
Color | Silver [65] | Silver [66] | Silver | Silver [67] | Silver |
Odor | Odorless [68] | Odorless | Odorless | Odorless [66] | Odorless |
Toxicity | Hight | Low | Low | Low | Low |
Boiling point |
356.73 °C [40,65] | 2204 °C [67] | Estimated similar to Galinstan® |
>1300 °C [67] | Similar to Galinstan® |
Melting point |
-38.83 °C [65,67] | 29.76 °C [66,69,70] | ∼15.5 °C [69] | -19 °C [67,71] | 11 °C [72], [64] |
Density | 13.534 g/cm3 [65] |
5.904 g/cm3 [66] |
6.2275 g/cm3 [73] |
6.44 g/cm3 [67] |
6.44 g/cm3 [64,66] |
Solubility | Insoluble [68] | Insoluble | Insoluble | Insoluble [66] | Insoluble |
Viscosity | 1.526 x 10-3 Pa·s @ 25 °C [64] |
1.921 x 10-3 Pa·s @ 50 °C [64] |
1.99 x 10-3 Pa·s [73] |
2.4 x 10-3 Pa·s [63] | ∼2.25 x 10-3 Pa·S @ 25 °C [74] |
Thermal conductivity |
8.541 W/(m·K) [64] 8.3 W/(m·K) [65] |
29 W/(m·K) [66] |
26.43 W/(m·K) [74] |
16.5 W/(m·K) [63] | ∼25.41 W/(m·K) [66] |
Electrical conductivity |
1.04 x 106 S/m [65] |
7.1 x 106 S/m [66] |
3.46 x 106 S/m [71] 3.4 x 106 S/m [63] |
2.299 x 106 S/m [63] 3.83 ± 0.16 x 106 S/m @ 3-20 GHz |
3.46 x 106 S/m [68] |
Surface tension |
>0.4 N/m [71] | >0.5 N/m [75] |
>0.5 N/m [75] ∼0.624 N/m [70] ∼0.435 N/m w/ HCl [71] |
>0.5 N/m [75] 534 ± 10.7 mN/m [75] |
0.718 N/m @ 20 °C [66] |
Reference | Technology | Phase shifting(°) | IL(dB) | FoM(°/dB) | Resolution(°) | RMS 8 phase error(°) | RMS amplitude error(dB) | Size(mm) |
---|---|---|---|---|---|---|---|---|
[76] | Liquid Metal | 367.6 | <2.8 | 13.3 | ≈ 45 | 20 | <1.5 | 57.2*14 |
[77] | Liquid Metal | 180 | 2.3 | 78.3 | 10 | 10 | NA | 87.2*56.2 |
[78] | Liquid Metal(Non Uniform) | 367.6 | <2.8 | 131.3 | ≈ 45 | 20 | <1.5 | 57.2*14 |
[78] | Liquid Metal(Uniform) | 379.5 | <3.1 | 122.4 | ≈ 45 | 20 | <1.5 | 57.2*14 |
[79] | Ferroelectric based | 413 | 10.3 | 40.1 | NA | NA | >3 | 3.8*2.3 |
[80] | Ferrite-LTCCC | 215 | <7 | 48 | NA | NA | NA | ≈ 45*45 |
[81] | Liquid Crystal | ≈ 60 | 2.5 | 24 | NA | NA | NA | NA |
[82] | Liquid Crystal | ≈ 101 | ≈ 5 | 15.2 | NA | NA | NA | NA |
[83] | Liquid Crystal | 461 | 4.35 | 105.9 | NA | NA | NA | NA |
[84] | GaN | 180 | 14 | 12.8 | 11.25 | 4.5 | ≈ 0.6 | 4.7*5 |
[85] | 0.25 µm SiGe BiCMOS | 360 | <12 | <30 | 11.25 | 6.4 | >3.0 | 1.87*0.88 |
[86] | 0.13 µm CMOS | 360 | 27.3 | 5.625 | 4.1 | ≈ 0.8 | 2.06 × 0.58 | |
[87] | 0.18 µm SiGe BiCMOS | 360 | 11.9 | 30.25 | 5.625 | 4.6 | ≈ 0.6 | NA |
[88] | 0.25 µm SiGe BiCMOS | 360 | ≈ 13 | 27.7 | 5.625 | 4 | ≈ 0.6 | 3.42 × 0.95 |
[88] | PIN Diode-SIW | <180 | ≈ 2 | ≈ 90 | NA | NA | >0.8 | NA |
Ref. | Liquid Metal | Benefits | Limits |
---|---|---|---|
1 | Galinstan | -Enable reversibility and reconfigurability of the phase shifter. -Provide a wide operating frequency range suitable for various applications. -Provide flexibility -Efficient performance |
-Limitation in the frequency range -Nonlinearity |
2 | Galinstan R and EGaIn | -Offers stretchability -Ensures safety in handling and operation -High performance |
-Hight weight and sagging -Air gaps -Fabrication Complexity |
3 | Gallium | -Reconfigurability: which combines the advantages of planar antennas with millimeter wave and Internet of Things technologies. -Wide Phase Shift Range. -Low Insertion Loss. |
-Reconfiguration speed. -Fabrication Complexity. -Reliability Issues. -Performance Restrictions. |
4 | Gallium | -Reconfigurability,Liquid metal can be easily reconfigured. -Wide Phase Shifting Range. Low Insertion Loss. -Compact Design. |
- Have an impact on performance. -Corrosion and Oxidation. -Cost: expensive than using conventional solid-state materials |
5 | Gallium | -Wide range of phase shift (0° to 360°). -Operation at 10 GHz with low insertion losses, suitable for high-power RF applications. -Exceptionally low insertion loss. -Compact electrical footprint |
-Differences between measured and simulated phase responses -The use of liquid metal into the SIW framework has presented challenges with dependability and longevity. -Possible need for additional optimization to resolve differences in performance |
6 | Galinstan EGaIN | -Large Phase Tuning Ratio -Low Insertion Loss -Compact Design -High Power Handling Capability |
-Impact on RF Performance -Size Considerations -Fabrication Difficulties -Integrity Maintenance |
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