ARTICLE
|
doi:10.20944/preprints202206.0245.v1
Subject:
Engineering,
Mechanical Engineering
Keywords:
MEMS vibrometer; Structural Health Monitoring (SHM); Guided Ultrasonic Waves (GUW); Fiber Metal Laminates (FML); wafer bonding
Online: 17 June 2022 (03:55:30 CEST)